Koch-Chemie Polish & Sealing Foam Pad Extra Fine Finishing Sponge Pad

The Polish & Sealing Foam Pad is an extra fine foam pad, designed for the even, controlled application of sealants and waxes.

Thanks to its low height of 25 mm, it generates low torsional forces, improving stability and handling during use. The open cell structure and optimised cross-linking ensure uniform product distribution, ensuring a high level of abrasiveness for a streak-free finish.

The milled edge provides greater flexibility, allowing the pad to adapt perfectly to the contours of the surface to be treated. The colored non-woven fiber material ensures safe and uniform sanding, reducing the risk of unwanted marks on the surface.

Available Formats

• Ø 45 x 25 mm
• Ø 126 x 25 mm
• Ø 150 x 25 mm

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